Liquid metal matrix thermal paste

C - Chemistry – Metallurgy – 09 – K

Patent

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356/113, 31/39

C09K 5/00 (2006.01) B22F 1/02 (2006.01) C22C 1/02 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2018930

A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100°C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

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