C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
356/113, 31/39
C09K 5/00 (2006.01) B22F 1/02 (2006.01) C22C 1/02 (2006.01) H01L 23/373 (2006.01)
Patent
CA 2018930
A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100°C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.
Booth Richard B.
Grube Gary W.
Gruber Peter A.
Khandros Igor Y.
Zingher Arthur R.
International Business Machines Corporation
Saunders Raymond H.
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