Liquid phenolic resin composition and method for waferboard...

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/5413, 154/97

C08L 61/10 (2006.01) C08G 8/10 (2006.01) C08L 61/06 (2006.01) C08L 97/02 (2006.01)

Patent

CA 1160389

ABSTRACT OF THE DISCLOSURE A pre-cure resistant liquid phenol-formaldehyde resin binder composition having low viscosity and low surface tension for efficient spray application as fine droplets in waferboard manufacture comprising a highly condensed and cross-linkable phenol-formaldehyde resin of relatively high average molecular weight and a non-resinous methylolated phenol condensate having an average molecular weight of 200-300.

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