G - Physics – 03 – F
Patent
G - Physics
03
F
356/1, 96/176
G03F 7/027 (2006.01) G03F 7/033 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2025198
Varnell Case 1 LIQUID SOLDER MASK COMPOSITION Abstract of the Disclosure Disclosed is a UV-curable, aqueous-developable liquid solder mask composition comprising (1) 40% to 70% of a non- reactive binder that is a film-forming random copolymer of (a) one or more (meth)acrylic alkyl ester monomers, at least one of which is an ester of a 4-12 carbon alkanol, (b) acrylic or methacrylic acid, and optionally (c) styrene or .alpha.-methyl- styrene, (2) 20% to 40% of one or more (meth)acrylic ester monomers containing two or more ethylenic double bonds, wherein at least one of the monomers has at least four ethylenic double bonds, (3) 1% to 5% of a photoinitiator, (4) 5% to 15% of a filler, all percentages being by weight based on the nonsolvent components of the composition, and (5) 35% to 70% of an organic solvent, based on the total weight of the composition.
Macdermid Imaging Technology Incorporated
Smart & Biggar
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