Low application temperature elastic adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 153/02 (2006.01) A61L 15/58 (2006.01) C08L 53/02 (2006.01)

Patent

CA 2554813

Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275~ F of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.

L'invention concerne des adhésifs thermofusibles applicables à basse température, qui sont particulièrement utiles en tant qu'adhésifs de fixation élastique. Les adhésifs ont une viscosité de moins d'environ 8,000 cp à 275· F, une limite élastique apparente de moins d'environ 80 psi et une performance de fluage pour un lien créé par l'application de torons de moins d'environ 15 %. On préférera des adhésifs qui ont une performance de fluage pour un lien formé par l'application de spirales de moins d'environ 25 %.

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