Low application temperature hot melt adhesive

Details Low application temperature hot melt adhesive Low application temperature hot melt adhesive

C - Chemistry, Metallurgy

09

J

C09J 4/00 (2006.01) C09J 123/08 (2006.01) C09J 125/00 (2006.01) C09J 125/02 (2006.01) C08L 23/08 (2006.01) C08L 31/04 (2006.01) C08L 91/06 (2006.01) C08L 93/04 (2006.01)

Patent

CA 2260675

A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from ethylene vinyl acetate with greater than 30 weight percent VA and having a melt index of at least 700 dg/min; a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene, and/or vinyltoluene, and polymers, copolymers and terpolymers thereof; a compatible adhesive promoting tackifier; and wax with a melting point of about 130 to 170°F (54 to 77°C); and optionally comprising ethylene vinyl acetate with less than about 30 weight percent by weight of vinyl acetate and having a melt index of about 400 to 2500 dg/min.

L'invention concerne une composition thermoadhésive à faible température d'application et son utilisation dans une formation de carton, de caisse ou de plateau composée d'acétate de vinyle-éthylène ayant plus que 30 % en poids d'acétate de vinyle et ayant un indice de fluidité d'au moins 700 dg/min; une résine hydrocarbonée thermoplastique dérivée de styrène, d'alpha-méthylstyrène et/ou de vinyltoluène, et les polymères, copolymères et terpolymères qui s'y rattachent; un agent poisseux adhésif compatible; et une cire ayant un point de fusion d'environ 130 à 170 degrés F (54 à 77 degrés C); et, comme option, une acétate de vinyle-éthylène de moins de 30 % en poids par masse d'acétate de vinyle et un indice de fluidité d'environ 300 à 2500 dg/min.

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