C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 123/08 (2006.01) B31B 1/62 (2006.01) C08L 65/00 (2006.01) C09J 191/06 (2006.01) C09J 193/00 (2006.01) C08L 23/08 (2006.01)
Patent
CA 2169575
Hot melt adhesive compositions consisting essentially of: a) 15 to 45% by weight of at least one ethylene n-butyl acrylate copolymer containing 15 to 40% by weight n-butyl acrylate and having a melt index of at least 600; b) 25 to 55% of a terpene phenolic tackifying resin or a hydrogenated derivative thereof, the resin having a Ring and Ball softening point less than 125°C; c) 15 to 40% by weight of a low melting point synthetic Fischer- Tropsch wax; and d) 0 to 1.5% stabilizer. The adhesives are characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability.
Birch Julie
Liedermooy Ingrid
Puletti Paul P.
Stauffer Daniel C.
Ablestik Laboratories
Borden Ladner Gervais Llp
National Starch And Chemical Investment Holding Corporation
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