C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 153/00 (2006.01) B65B 51/02 (2006.01) B65D 33/18 (2006.01) C09J 191/06 (2006.01)
Patent
CA 2255793
A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) from about 5 % to about 25 % by weight of a compatible plasticizer; and e) from about 10 % to about 40 % by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150 ~C.
L'invention a trait à un adhésif thermofusible utile dans l'emballage, comportant: a) de 10 % environ à 40 % environ en poids d'un copolymère bloc, b) jusqu'à 20 % environ d'un polymère compatible, la teneur totale en polymère ne dépassant pas 40 % en poids, c) de 25 % environ à 60 % environ en poids d'au moins une résine à pouvoir collant, d) de 5 % environ à 25 % environ en poids d'un plastifiant compatible, et e) de 10 % environ à 40 % environ en poids d'au moins un composant du type cire, la viscosité de l'adhésif thermofusible étant inférieure à 1500 cPs environ à une température de 150 ·C environ.
H.b. Fuller Licensing & Financing Inc.
Rogers Law Office
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