Low cost wet-to-wet pressure sensor package

Details Low cost wet-to-wet pressure sensor package Low cost wet-to-wet pressure sensor package

G - Physics

01

L

73/3

G01L 7/08 (2006.01) G01L 9/00 (2006.01)

Patent

CA 2011431

A wet-to-wet pressure sensor package having a housing with a pressure sensitive semiconductor die supported within a resilient mounting including continuous beads of elastomeric adhesive on the same portion of the housing to provide a protective seal with less stress so that improved sensitivity and repeatability of the wet-to-wet pressure sensor is achieved.

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