Low-density, class a sheet molding compounds containing...

B - Operations – Transporting – 29 – C

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B29C 43/28 (2006.01)

Patent

CA 2607932

Resin formulations for sheet molding compounds include low-density thermosetting sheet molding compounds (SMC) comprising an organic-modified, inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low-density filler, but no calcium carbonate. Reactive monomers include aromatic, multiethylenically-unsaturated compounds that aid thermosetting SMC in yielding exterior and structural thermoset articles, e.g. auto parts, panels, that have Class A Surface Quality. Sheet molding paste formulations include a thermosetting resin, an ethylenically unsaturated monomer, an alternative reactive monomer, a low profiling additive, and a nanoclay filler composition, wherein the SMC has a density less than about 1.25 g/cm 3 . A reinforcing roving can be included.

De façon générale, la présente invention concerne des préparations de résine pour composés de moulage en feuille. Plus particulièrement, mais pas uniquement, l'invention concerne des composés pour moulage en feuille à thermofixage, de faible densité (SMC) comprenant un argile inorganique modifié organiquement, une résine thermofixable, un agent à très faible retrait, un agent de renfort, une charge basse densité, sensiblement en l'absence de carbonate de calcium. L'invention concerne en particulier des monomères réactifs de substitution présents en tant que composés aromatiques mutliéthylèniquement insaturés qui facilitent le thermofixage de SMC pour la production d'articles thermofixés pour extérieur et structures tels que pièces et panneaux pour automobiles présentant une qualité de surface de classe A.

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