Low-density, class a sheet molding compounds from...

Details Low-density, class a sheet molding compounds from... Low-density, class a sheet molding compounds from...

C - Chemistry, Metallurgy

08

K

C08K 9/04 (2006.01)

Patent

CA 2607943

The present disclosure relates generally to resin formulations for sheet molding compounds. Particularly, but not by way of limitation, the invention relates to low-density thermosetting sheet molding compounds (SMC) comprising an organic-modified, inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low-density filler, and substantially the absence of calcium carbonate. The present disclosure relates particularly to blends of isophthalate modified, maleic-glycol polyester resin-glycol and maleate-glycol polyester resins that provide low density, thermosetting SMC that yields exterior and structural thermoset articles, e.g. auto parts, panels, etc that have Class A Surface Quality.

De façon générale, la présente invention concerne des préparations de résine pour composés de moulage en feuille. Plus particulièrement, mais pas uniquement, l'invention concerne des composés pour moulage en feuille à thermofixage, de faible densité (SMC) comprenant un argile inorganique modifié organiquement, une résine thermofixable, un agent à très faible retrait, un agent de renfort, une charge basse densité, sensiblement en l'absence de carbonate de calcium. L'invention concerne en particulier des mélanges de résine de polyester glycol maléique modifiées isophtalate et de résines de polyester de maléate glycol et de glycol donnant des SMC thermofixables de faible densité en vue de la production d'articles thermofixés pour extérieur et structures tels que pièces et panneaux pour automobiles à qualité de surface de classe A.

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