Low dielectric constant laminate of fluoropolymer and...

Details Low dielectric constant laminate of fluoropolymer and... Low dielectric constant laminate of fluoropolymer and...

B - Operations, Transporting

32

B

154/126, 356/21

B32B 15/08 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1298770

TITLE LOW DIELECTRIC CONSTANT LAMINATE OF FLUOROPOLYMER AND POLYARAMID ABSTRACT A laminate comprising a perfluoropolymer reinforced with polyaramid positioned between two layers of copper is disclosed. The laminate comprises in order (1) a layer of copper, (2) a layer of fluoropolymer selected from the group consisting of polytetrafluoroethylene, a copolymer of tetrafluoroethylene and hexafluoropropylene, a copolymer of tetrafluoroethylene and perfluoro (propyl vinyl ether), a terpolymer of tetrafluoroethylene, hexafluoropropylene, and perfluoro (propyl vinyl ether) and a terpolymer of tetrafluoroethylene, hexafluoropropylene, and perfluoro (ethyl vinyl ether) which is reinforced with a woven or non-woven fabric of polyaramid fiber, such that the volume percent of polyaramid on the basis of the total of polyaramid plus fluoropolymer is less than about 40, and (3) a second layer of copper. The laminates may be used in printed circuit boards.

585769

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