Low dissipation factor coating powder

Details Low dissipation factor coating powder Low dissipation factor coating powder

C - Chemistry, Metallurgy

08

G

402/192, 402/266

C08G 59/42 (2006.01) C08G 59/68 (2006.01) C09D 163/00 (2006.01) H01B 3/40 (2006.01) H01B 13/06 (2006.01)

Patent

CA 1177598

ABSTRACT OF THE DISCLOSURE A coating powder is disclosed which is prepared from a solventless non-aqueous composition of a solid epoxy resin having an epoxy equivalent weight of about 400 to about 8000, a Durran's softening point of at least 70°, a solid polyanhydride curing agent at least about 50 mole % of which is trimellitic anhydride, and a cross-linking agent having the general formula R3SnX where each R is selected from alkyl, aryl, aralkyl, and alkaryl up to C20 and X is selected from acetate, propionate, butyrate, halogen, and hydroxyl. The composition is dry-blended and powder, it is then cooled, crushed, and ground to a parti- cle size of less than 100 microns. The coating powder is electrostatically applied to a conductor and is cured above the melting point of the resin.

351996

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