Low emissions one part adhesive

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

C08K 5/16 (2006.01)

Patent

CA 2588302

An adhesive composition which can be formulated to have low or substantially no VOC emissions is provided. Adhesives in accordance with the invention can be formulated as high solids, one-part, reactive, cross-linked adhesives. This can be achieved by utilizing amide-ester-acrylate reactions or reactions with any other carboxylated polymers. Adhesive compositions in accordance with the invention can include oils, such as various drying oils and similarly acting polymers, co-polymers, and fatty acids. Adhesives in accordance with the invention can also include various hydrocarbon resins, particularly crosslinkable hydrocarbons having a melting point in the range 70~C to 140~C. Cross-linking agents, such as materials with pendant oxazoline groups are also advantageously included. Various other mixing, flow and other handling ingredients can also be included.

La présente invention concerne une composition d'adhésif qui peut être préparée de manière à avoir peu ou essentiellement pas d'émissions de COV. Les adhésifs selon cette invention peuvent être préparés sous formes d'adhésifs réactifs monocomposants réticulés à haute teneur en solides. A cette fin, on utilise des réactions amide-ester-acrylate ou des réactions avec n'importe quels autres polymères carboxylés. Les compositions d'adhésif selon cette invention peuvent comprendre des huiles, telles que diverses huiles siccatives et des polymères, des copolymères et des acides gras à activité similaire. Les adhésifs peuvent aussi comprendre diverses résines hydrocarbures, en particulier des hydrocarbures réticulables présentant un bas point de fusion situé entre 70 °C et 140 °C. Il est également avantageux qu'ils comprennent des agents de réticulation, tels que des matières avec des groupes oxazoline pendants. Divers autres ingrédients de mélange, d'écoulement et de manipulation peuvent également être compris.

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