Low expansion composition for packaging optical waveguide...

Details Low expansion composition for packaging optical waveguide... Low expansion composition for packaging optical waveguide...

C - Chemistry, Metallurgy

08

L

C08L 101/00 (2006.01) C08K 3/00 (2006.01) C08K 3/40 (2006.01) C08K 7/02 (2006.01) G02B 6/26 (2006.01) G02B 6/28 (2006.01) G02B 6/44 (2006.01)

Patent

CA 2083983

ABSTRACT OF THE DISCLOSURE A rigid, low expansion formable housing composition can be used to package optical waveguide couplers. The housing is in intimate contact with and strongly bonded to the coupler being packaged. The housing composition includes a formable polymeric resin, a glass-ceramic or ceramic or glass filler, and, optionally, strengthening fibers The filler has a low thermal expansion to compensate for the high expansion of the resin. A moisture barrier layer may be placed around the housing composition, and it is possible to incorporate a shock absorbing material between the housing and the moisture barrier layer.

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