B - Operations – Transporting – 22 – F
Patent
B - Operations, Transporting
22
F
75/166, 75/1.22
B22F 1/00 (2006.01) C22C 33/02 (2006.01) H01L 21/48 (2006.01) H01L 23/495 (2006.01)
Patent
CA 1087423
ABSTRACT A compacted article having low thermal expansivity and high thermal conductivity is made by compacting a mixture of two metal powders, one of which has low thermal expansivity and the other of which has high thermal conductivity, and strip material made therefrom which is suitable for use in forming the supportive lead frames in integrated circuit components. The powders are mixed together, formed into a green compact, sintered, and rolled to size to produce strip which has a unique combination of lot; thermal expansivity and high thermal conductivity. A low-expan- ivity metal disclosed is an alloy containing about 45-70% iron, 20-55% nickel, up to 25% cobalt, and up to 5% chromium which in powder form is mixed with a high-conductivity metal powder disclosed as substantially elemental iron, copper or nickel.
304871
Carpenter Technology Corporation
Gowling Lafleur Henderson Llp
LandOfFree
Low expansion low resistivity composite powder metallurgy... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low expansion low resistivity composite powder metallurgy..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low expansion low resistivity composite powder metallurgy... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-9970