Low expansion polymeric compositions

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

C08K 3/40 (2006.01) C08K 3/32 (2006.01) C08K 9/02 (2006.01) C08K 9/06 (2006.01) C08K 13/06 (2006.01) C08L 101/00 (2006.01) G02B 6/255 (2006.01) G02B 6/26 (2006.01) G02B 6/28 (2006.01) G02B 6/38 (2006.01)

Patent

CA 2146400

Polymeric compositions having a polymeric component and an inorganic filler which undergoes a crystal (phase) inversion within the operating temperature range of the composition are provided. The compositions exhibit low coefficients of thermal expansion (CTEs) and can be formulated to have a negative CTE. Among other applications, the compositions can be used as adhesives in the assembly of optical waveguide couplers and as packaging compounds for such couplers.

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