Low formaldehyde emission coatings and binders from...

Details Low formaldehyde emission coatings and binders from... Low formaldehyde emission coatings and binders from...

C - Chemistry, Metallurgy

09

D

C09D 133/26 (2006.01) B27N 3/00 (2006.01) C08L 61/06 (2006.01) C08L 61/24 (2006.01) C08L 61/28 (2006.01) C09D 161/06 (2006.01) C09D 161/28 (2006.01) C09D 161/32 (2006.01) C09J 161/28 (2006.01)

Patent

CA 2399783

Disclosed is a low formaldehyde emission coating from formaldehyde-based resins that can be applied to a panel for reducing sag and enhancing the strength of the panel. Formaldehyde emissions are reduced by the inclusion of polymeric formaldehyde reactive materials comprising a polyamide scavenger into the coating formula. These formulations are useful as coatings or binders.

On présente un revêtement à faible émission de formaldéhyde obtenu à partir de résines à base de formaldéhyde pouvant être appliqué sur un panneau pour en prévenir l'affaissement et en accroître la résistance. Les émissions de formaldéhyde sont réduites grâce à l'inclusion de matières polymériques réagissant avec le formaldéhyde, dont un composé piégeant les amides. Ces formulations peuvent être utilisées comme revêtement ou comme liant.

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