Low fusion copolymer resin

Details Low fusion copolymer resin Low fusion copolymer resin

C - Chemistry, Metallurgy

08

F

402/357

C08F 214/06 (2006.01) C08F 218/08 (2006.01) C08F 230/02 (2006.01) C08J 9/10 (2006.01)

Patent

CA 1086446

LOW FUSION COPOLYMER RESIN Abstract of the Disclosure An emulsion copolymer resin which contains from about 75% to about 90%, by weight vinyl chloride, from about 5% to about 15% vinyl acetate and from about 5% to about 15% of a bis(hydrocarbyl) vinylphosphonate, has a fusion temperature of from about 200°F. to about 300°F, and has utility as a low fusion resin in the formation of cellular polyvinyl chloride products.

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