C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
403/54
C08J 9/14 (2006.01)
Patent
CA 1249393
Abstract of the Disclosure Generally closed cell phenolic foams are prepared which have a K-factor of less than 0.029, watt/(m-K) preferably from 0.017 to 0.024 watt/(m-K) of foam thickness when measured at 24° Centigrade. The foams are prepared from a resole resin which has been stripped to a water level of less than 7 percent by weight, preferably from 3 to about 6 percent by weight based on resin weight. A viscosity adjusting amount of a solvent, such as phenol, and from 10 to 20 weight percent, based on resin weight, of a polyglycol are also part of a foam forming formu- lation. Conventional surfactants, blowing agents and acidic catalysts are used to prepare the foams. The foams so prepared generally have no tendency to autoxidize when placed in an oven heated to a temperature of 250° Centigrade. The foams so pre- pared also have enhanced resistance to flame penetra- tion.
483530
Smart & Biggar
The Dow Chemical Company
LandOfFree
Low k-factor closed cell phenol-aldehyde foam and process... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low k-factor closed cell phenol-aldehyde foam and process..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low k-factor closed cell phenol-aldehyde foam and process... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1274189