C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 75/14 (2006.01) C09D 4/00 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2041114
LOW LEACHING UV CURABLE SEALANT AND ENCAPSULANT WITH POST CURE MECHANISM ABSTRACT A mixture of 100 parts by weight of acrylated urethane oligomer, 50 to 60 parts by weight of hydroxypropyl- methacrylate, 3.0 to 3.5 parts by weight of hydroxymethyl- phenylpropanone, 1.9 to 2.1 parts by weight of l,l-bis- (t-butylperoxy)cyclohexane and 11 to 12 parts by weight of amorphous silica filler provides a composition curable by exposure to ultraviolet radiation which is post curable by heating. The compositions are storable in a single package and are useful for coating and encapsulating electronic components, such as printed wire boards. Articles of poly(phenylene)sulfide and the cured composition are useful for military electronic applications. These articles can also be overcoated with parylene.
Juen Donnie R.
Thanawalla Chandrakant B.
Dow Corning Corporation
Gowling Lafleur Henderson Llp
LandOfFree
Low leaching uv curable sealant and encapsulant with post... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low leaching uv curable sealant and encapsulant with post..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low leaching uv curable sealant and encapsulant with post... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1857432