Low lead copper alloy

C - Chemistry – Metallurgy – 22 – C

Patent

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C22C 9/04 (2006.01)

Patent

CA 2680214

The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt% of lead, 0.3 to 0.8 wt% of aluminum, 0.01 to 3 wt% of bismuth, 1 to 4 wt% of silicon, 0.1 to 1 wt% of tin, and more than 93.6% of copper and zinc, wherein copper is in an amount ranging from 61 to 78 wt%. The low-lead copper alloy of the present invention has excellent toughness and processability, and can provide increased resistance in an environment with a high concentration of chlorine ions.

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