C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 9/04 (2006.01)
Patent
CA 2680218
The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt% of lead (Pb), 0.3 to 0.8 wt% of aluminum (Al), 0.01 to 0.4 wt% of bismuth (Bi), 0.1 to 2 wt% of nickel (Ni), and more than 96.5 wt% of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt%. The low-lead copper alloy of the present invention has excellent material properties as well as good toughness and processability, thereby increasing the alloy strength and corrosion resistance thereof.
Lo Wenlin
Peng Xiaoming
Battison Williams Dupuis
Modern Islands Co. Ltd.
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