Low-lead copper alloy

C - Chemistry – Metallurgy – 22 – C

Patent

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C22C 9/04 (2006.01)

Patent

CA 2680218

The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt% of lead (Pb), 0.3 to 0.8 wt% of aluminum (Al), 0.01 to 0.4 wt% of bismuth (Bi), 0.1 to 2 wt% of nickel (Ni), and more than 96.5 wt% of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt%. The low-lead copper alloy of the present invention has excellent material properties as well as good toughness and processability, thereby increasing the alloy strength and corrosion resistance thereof.

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