Low loss material for the manufacture of pcb's and antenna...

Details Low loss material for the manufacture of pcb's and antenna... Low loss material for the manufacture of pcb's and antenna...

H - Electricity

05

K

H05K 3/20 (2006.01) B32B 15/08 (2006.01) H05K 3/38 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2348581

A method of manufacturing a low loss printed circuit board material including the steps of providing a substrate comprising at least one layer of cross-linked polyethylene, providing a conducting foil, bringing a surface of the foil together with a surface of the substrate, casting a bonding layer of molten polyethylene between the surfaces, laminating the foil onto the substrate and cross-linking the bonding layer.

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