C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
76/20, 57/21, 75
C22C 9/04 (2006.01) B23P 15/28 (2006.01) B24D 3/10 (2006.01) C04B 35/52 (2006.01) C22C 1/04 (2006.01) C22C 9/05 (2006.01) C22C 26/00 (2006.01) E21B 10/46 (2006.01)
Patent
CA 2033628
ABSTRACT OF THE DISCLOSURE A novel infiltration alloy comprises about 5 to 65% by weight of manganese, up to about 35% by weight of zinc, and the balance copper. Preferably, the infiltration alloy comprises 20 by weight of manganese, 20% by weight of zinc, and the balance copper. The infiltration alloy is useful in the manufacture of matrix bodies such as matrix drill bit bodies. A method for the manufacture of a matrix body comprises forming a hollow mold for molding at least a portion of the matrix body, positioning diamond cutting elements in the mold, packing at least a part of the mold with a powder matrix material, infiltrating the matrix material with the novel infiltration alloy in a furnace to form a mass, and allowing the mass to solidify into an integral matrix body. Because the novel infiltration alloy permits infiltration to be carried out at temperatures below about 1050°C, many diamond cutting elements which begin to deteriorate at temperatures above 1000°C can be bonded without substantial degradation to the matrix body during the infiltration process, and there is no need to secure them to the matrix body in a subsequent brazing or mechanical bonding step.
Anthon Royce A.
Horton Ralph M.
Anthon Royce A.
Gowling Lafleur Henderson Llp
Horton Ralph M.
Norton Company
LandOfFree
Low melting point copper-manganese-zinc alloy for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low melting point copper-manganese-zinc alloy for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low melting point copper-manganese-zinc alloy for... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1859229