Low pressure molding compounds

Details Low pressure molding compounds Low pressure molding compounds

C - Chemistry, Metallurgy

08

L

400/4009

C08L 67/06 (2006.01) C08K 3/22 (2006.01)

Patent

CA 1070881

ABSTRACT OF THE DISCLOSURE A moldable composition is provided comprising an unsatu- rated, crosslinkable thermosettable resin, an ethylenically un- saturated monomer, a thermoplastic resin soluble in said monomer, and a gelling agent consisting essentially of calcium hydroxide in an amount sufficient to gell said composition to a substan- tially stable viscosity at which said composition can be molded at a low pressure.

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