Low profile fan body with heat transfer characteristics

F - Mech Eng,Light,Heat,Weapons – 04 – D

Patent

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Details

F04D 29/58 (2006.01) H01L 23/467 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2147752

A low profile, heat transfer, electronic component cooling fan is disclosed. The heat transfer body (20) includes a pressure differential surface (34) formed around the outer perimeter of the fan blades (30) within a first segment of the axial blade depth region. An interface surface (38) for connection to the electronic component is positioned opposite of the fan frame (25). Some heat transfer devices (45) are disposed between the frame (25) and the interface surface (38), such that the heat transfer devices (45) are positioned within a second segment of the axial blade depth region.

La présente invention a pour objet un ventilateur de refroidissement surbaissé à échange thermique pour appareil électronique. Le corps de transfert thermique (20) comporte une surface de pression différentielle (34) formée autour du périmètre extérieur des pales du ventilateur (30), à l'intérieur de la région correspondant au premier segment de la profondeur axiale des pales. Une surface d'interface (38) servant au raccordement avec l'appareil électronique est positionnée en opposition avec le canal du ventilateur (25). Certains dispositifs de transfert thermique (45) sont disposés entre le canal du ventilateur (25) et la surface d'interface (38), de telle sorte que les dispositifs de transfert thermique (45) sont positionnés à l'intérieur de la région correspondant au deuxième segment de la profondeur axiale des pales.

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