Low profile headerless smt compatible magnetics package

Details Low profile headerless smt compatible magnetics package Low profile headerless smt compatible magnetics package

H - Electricity

05

K

H05K 13/04 (2006.01) H01F 27/28 (2006.01) H01F 27/29 (2006.01) H05K 3/32 (2006.01) H01F 17/00 (2006.01)

Patent

CA 2232080

There is provided a headerless magnetics package for surface mount assembly onto a circuit substrate. The magnetic package has a ferromagnetic core and winding turns for the ferromagnetic core. The winding turns are formed from electrically conductive plates that are disposed in a stacked arrangement surrounding at least a portion of the core. The conductive plates each provide two connections for the supply of electrical current to the winding turns. The magnetics package further provides a number of electrical connectors. Each connector is attached to predetermined conductive plates of the package at corresponding connections of the package. Each of the connectors is directly mountable onto the circuit substrate to thereby form an electrically conductive pass beginning at the circuit substrate, then passing through the conductive plates and returning to the circuit substrate.

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