Low profile integrated circuit socket

H - Electricity – 05 – K

Patent

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Details

339/11.1

H05K 1/16 (2006.01) H05K 7/10 (2006.01)

Patent

CA 1074412

ABSTRACT OF THE DISCLOSURE An integrated circuit package socket of a "low profile" construction with a contact designed to co-act with the socket body to provide a dual spring action preventing the contact leaves from becoming overstressed upon insertion therein of relatively large leads; the socket contact being mounted on a base or retainer having a contact socket which allows it to be mounted and clamped thereto in a side loading operation eliminating "wicking" during the subsequent soldering.

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