Low profile modular phone jack assembly

Details Low profile modular phone jack assembly Low profile modular phone jack assembly

H - Electricity

01

R

339/10

H01R 9/09 (1990.01)

Patent

CA 1276996

8491-44 ABSTRACT OF THE DISCLOSURE A low profile right angle phone jack for use with printed cir- cuit boards is disclosed. The jack includes a dielectric housing member having a modular plug receiving socket formed therein, a forward mating end and a rearward end. The socket is defined by a plug-receiving opening formed in the forward mating end with a low- er latch receiving region and extends rearwardly to meet a back surface provided in the housing member. The housing member is mounted with its forward mating end disposed beyond an edge of the printed circuit board. The forward mating end of the housing mem- ber is offset downwardly so that the lower latch receiving region of the plug receiving opening is below the upper surface of the circuit board. In addition, the housing member cooperates with the printed circuit board surface to define the socket whereby the upper surface of the circuit board is the bottom surface of the socket. The low profile modular jack is for use with printed circuit boards arranged in modern closely spaced mother-daughter arrangements.

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