Low profile resistor

Details Low profile resistor Low profile resistor

H - Electricity

01

C

H01C 1/02 (2006.01) H01C 1/012 (2006.01)

Patent

CA 2203701

A low profile load resistor (10) includes a base plate (12) of an electrically conductive material having a pair of opposed flat surfaces (14, 16) and a central hole (18) therethrough. A chip resistor (22) is mounted on one of the surfaces of the base plate (12). The chip resistor (22) includes a substrate (24) of an electrical insulating material having a pair of opposed flat surfaces (26, 28) and a central hole (30) therethrough which is aligned with the central hole (18) in the base plate (12). A resistance film (38) is on one of the surfaces (26) of the substrate (24) and has termination films (32, 34) at opposite ends thereof. A termination tab (42) is electrically connected to one (32) of the termination films (32, 34) and extends through the holes (18, 30) in the substrate (24) and the base plate (12). The other termination film (34) is electrically connected to the base plate (12). A cover plate (48) of an electrical insulating material is over the resistor film (38) and is mechanically connected to the substrate (24).

Résistance de charge extra-plate (10) comprenant une plaque de base (12) en matériau électroconducteur comportant une paire de surfaces plates opposées (14, 16) et un trou central (18) les traversant. Une résistance pastille (22) est montée sur une des surfaces de la plaque de base (12). La résistance pastille (22) comprend un substrat (24) en matériau électro-isolant comportant une paire de surfaces plates opposées (26, 28) et un trou central (30) les traversant et aligné sur le trou central (18) de la plaque de base (12). Une couche (38) résistante recouvre une des surfaces (26) du substrat (24) et comporte des couches de terminaison (32, 34) à ses extrémités opposées. Une languette de connexion (42) est raccordée électriquement à l'une (32) des couches de terminaison (32, 34) et s'étend dans les trous (18, 30) du substrat (24) et de la plaque de base (12). L'autre couche de terminaison (34) est connectée électriquement à la plaque de base (12). Une plaque de recouvrement (48) en matériau électro-isolant recouvre la couche (38) résistante et est raccordée mécaniquement au substrat (24).

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