Low-profile thermosyphon-based cooling system for computers...

F - Mech Eng,Light,Heat,Weapons – 28 – D

Patent

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F28D 15/00 (2006.01)

Patent

CA 2561769

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

L'invention concerne un système de refroidissement comprenant un thermosiphon destiné à des ordinateurs et à d'autres dispositifs électroniques. Ledit thermosiphon comprend un évaporateur placé sur la partie supérieure d'une source thermique, telle qu'une UC. La chaleur provenant de la source thermique entraîne l'évaporation ou l'ébullition du liquide de refroidissement à l'intérieur de l'évaporateur. La vapeur résultante entre dans un condenseur et revient en phase liquide. Des ailettes de refroidissement sont fixées au condenseur afin de faciliter un transfert de chaleur avec l'écoulement d'air environnant. Le système de refroidissement et un ordinateur ou un dispositif électronique s'ajustent à l'intérieur de boîtiers d'ordinateur normalisés et de boîtiers montables sur un bâti de serveur à densité élevée.

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