Low-shrink thermosetting polymers

Details Low-shrink thermosetting polymers Low-shrink thermosetting polymers

C - Chemistry, Metallurgy

08

L

400/4514

C08L 51/08 (2006.01)

Patent

CA 1049184

ABSTRACT OF THE DISCLOSURE The invention pertains to a one-part low-shrink or low-profile molding composition based on a dicyclopentadiene modified polyester resin. The molding resin compositions are stabilized emulsion comprising a thermosetting unsaturated polyester polymer modified with dicyclopentadiene, an ethylenically unsaturated monomer copolymerizable with the thermosetting poly- ester polymer, and a thermoplastic resin having acid groups whereby the molding resin compositions are suitable for thicken- ing with alkaline earth and/or hydroxide thickeners.

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