Low-stress coupling of electrooptical device to optical fiber

Details Low-stress coupling of electrooptical device to optical fiber Low-stress coupling of electrooptical device to optical fiber

G - Physics

02

B

G02B 6/42 (2006.01) G02B 6/38 (2006.01)

Patent

CA 2093135

2093135 9206397 PCTABS00011 Means for coupling an electrooptical device, such as a semiconductor laser, to an optical fiber avoids heat-induced stresses that commonly result from joining methods employing welding, soldering, or catalytic adhesive compositions. In this invention, the electrooptical device (11) and fiber (12) are firmly mounted within separate elements, such as copper tubes (13, 14), by means of potting compound or the like, and after close end-to-end supported alignment of the device and fiber elements to obtain optimum light coupling, the assemblage is immersed in an electrolytic plating solution (34). Plating current is then applied and maintained until a sufficiently strong layer (19) of plating metal encompasses the tubular elements and thereby rigidly fixes the alignment of the device and fiber end at its optimum position. Since the plating operation proceeds in a substantially isothermic environment, there is no misaligning stress introduced which would otherwise degrade the coupling efficiency.

Affiliated with

Also associated with

Rating

Low-stress coupling of electrooptical device to optical fiber does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low-stress coupling of electrooptical device to optical fiber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-stress coupling of electrooptical device to optical fiber will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1948683