Low stress epoxy encapsulant compositions

Details Low stress epoxy encapsulant compositions Low stress epoxy encapsulant compositions

C - Chemistry, Metallurgy

08

L

117/198, 400/410

C08L 83/04 (2006.01) C08L 63/00 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2010331

PATENT APPLICATION OF JAMES OLIVER PETERSON RAJIV HARSHADRAI NAIK GARY LEE LINDEN FOR LOW STRESS EPOXY ENCAPSULANT COMPOSITIONS DN 87-53 BWS/skm Abstract of the Disclosure A low stress additive system for epoxy encapsulants, and low stress epoxy encapsulants containing the low stress additive system are disclosed. The low stress additive system comprises composite organic polymer particles and liquid silicon- containing compounds, such as organopolysiloxanes. The epoxy encapsulants prepared with the low stress additive system display low stress, good flow, and do not exhibit excess resin bleed.

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