Low temperature activating adhesives for laminating plastic...

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 18/65 (2006.01) C08G 18/10 (2006.01) C08G 18/42 (2006.01) C08L 27/06 (2006.01) C08L 75/06 (2006.01) C09J 175/06 (2006.01)

Patent

CA 1143891

ABSTRACT OF THE DISCLOSURE Improved adhesive compositions for laminating plas- tic and particularly vinyl films to metal are described which contain about 15 to 30 percent by weight of a phenolic resol having a methylol content of about 15 to 50 percent by weight, about 25 to about 40 percent by weight of certain nonfunction- al polyurethanes having a molecular weight of at least 20,000 and preferably 60,000 to 300,000 and about 35 to 55 percent by weight of a vinyl solution polymer, all in an organic sol- vent. The nonfunctional polyurethanes are thermoplastic poly- esterurethanes devoid of reactive isocyanate and hydroxyl groups and are derived from monomeric polyisocyanates and poly- hydroxy compounds chain-extended with x low molecular weight diol, preferably a cycloaliphatic diol, to the desired molecu- lar weight. When the polyhydroxy compound is a polycaprolac- tone polyol, it is essential that chain extension be effected with a cycloaliphatic diol, preferably dimethylolcyclohexane. When the polyhydroxy compound is a polyester polyol other than polycaprolactone polyols, it is essential that the polyester be derived from a polycarboxylic acid component comprising at least 30 mol percent, based on total mols of polycarboxylic acid employed in preparing the polyester, of at least one aromatic carboxylic acid. Polycaprolactone polyols can also be reacted with a polycarboxylic acid component comprising at least 30 mol percent aromatic polycarboxylic acid, in which case chain extension need not be effected with a cycloalipha- tic diol. Especially preferred thermoplastic polyurethanes are obtained from the condensation of monomeric polyisocyan- ates and polyester polyols having an aromatic polycarboxylic content of at least 30 mol percent chain-extended with low molecular weight cycloaliphatic diol. The adhesives have ac- tivation temperatures as low as about 260°F. (ca. 125°C) which makes these particularly suitable for laminating vinyl films of 6 mi1s thickness or less to metals without distortion or loss of any embossing or printed decoration on the film.

352365

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