Low temperature adhesives for photographic materials

Details Low temperature adhesives for photographic materials Low temperature adhesives for photographic materials

C - Chemistry, Metallurgy

08

L

96/27, 400/3057

C08L 53/02 (2006.01) C08L 23/02 (2006.01) C08L 31/04 (2006.01) G03C 1/00 (2006.01) G03C 1/93 (2006.01) G03C 8/52 (2006.01)

Patent

CA 1110794

Abstract of the Disclosure Disclosed herein are non-pressure sensitive, heat sealable adhesive compositions having high bonding strengths at temperatures below 75°C which consist essentially of a mixture of a block copolymer of a vinylbenzene and a con- jugated diolefin, and a copolymer of an alkene and vinyl acetate. These adhesives are useful in a variety of radia- tion sensitive materials, but particularly in photographic materials such as photographic film units. In such units, they are particularly useful to bond barrier timing layers to other layers or substrates, but also may be used to bond other layers or substrates. - 1 -

284550

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