Low temperature bake water reducible acrylic enamel

Details Low temperature bake water reducible acrylic enamel Low temperature bake water reducible acrylic enamel

C - Chemistry, Metallurgy

09

D

400/5465

C09D 125/06 (2006.01) C08G 12/42 (2006.01) C09D 133/06 (2006.01) C09D 133/20 (2006.01) C08L 61/20 (2006.01)

Patent

CA 1117676

Abstract of the Disclosure A water-reducible acrylic enamel coating composi- tion capable of being substantially completely cured at a relatively low temperature, such as about 250°F and contain- ing a water-miscible partially etherified melamine formaldehyde cross-linking agent and an acrylic copolymerization product of about 3% to about 8% of an unsaturated carboxylic acid, about 10% to 30% of a hydroxy functional monomer and about 62% to 87% of a nonfunctional monomer. The acrylic copolymer is further characterized as having a glass transition temp- erature of about -10°C to 45°C and a molecular weight of about 2,000 to about 100,000. The aminoplast resin preferably is only partially etherified and contains about 10% to about 30% by weight reactive methylol groups.

311335

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