Low temperature co-fired ceramic (ltcc) high density...

Details Low temperature co-fired ceramic (ltcc) high density... Low temperature co-fired ceramic (ltcc) high density...

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 23/13 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01)

Patent

CA 2129047

14 LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) HIGH DENSITY INTERCONNECT PACKAGE WITH CIRCUITRY WITHIN THE CAVITY WALLS ABSTRACT OF THE DISCLOSURE A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.

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