Low temperature condensate adherence method and apparatus

B - Operations – Transporting – 01 – D

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B01D 59/04 (2006.01) B01D 59/34 (2006.01)

Patent

CA 1246325

ABSTRACT In an isotope separation system in which hot, isotopically separated vapor is deposited on enriched product and depleted tails plates, deposit adherence is improved and plate cooling simplified. The tails plate is liquid-cooled to a lower temperature which permits the product plate to be radiatively cooled by it simplifying product plate cooling and lowering its temperature to reduce the tendency for the product plate deposit to separate during temperature cycling. In one embodiment plate surfaces are cleaned of impurities in a vacuum by allowing the temperature of the tails plates to reach the relatively low operating tempera- ture prior to proceeding with the deposition. In another embodiment plate surfaces are provided with rough surfaces to promote air penetration during deposit stripping, which permits the formation of a brittle, more easily severed bond between plate and deposit. In a further embodiment for the deposition of biphasic materials, the operating temperature of the tails plate is set to the lowest temperature at which the lower thermal coefficient of expansion phase of the material will adhere to the tails plate.

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