Low temperature electronic package

Details Low temperature electronic package Low temperature electronic package

H - Electricity

01

L

356/29, 352/49

H01L 39/00 (2006.01) G11C 11/44 (2006.01) H01L 39/04 (2006.01) H01R 13/658 (2006.01)

Patent

CA 1203622

LOW TEMPERATURE ELECTRONIC PACKAGE Abstract The invention is a right angle connection utilizing an interposer rod between horizontal and vertical substrates. The interposer rod is of insulating material and has a superconducting metal ground plane on its surface, which ground plane is in turn covered by an insulating film. Over the insulating film, the interposer has a number of arcuate con- ductors to which respective conductors of both the horizontal and vertical substrates are connected at controlled collapse pads. This provides good electrical and mechanical connection. All circuits are effectively transmission lines because the underlying ground plane is continuous. The interposer rod provides a robust, low inductance connector mechanism with a strain minimizing con- figuration, which low inductance connector mechanism permits both horizontal and vertical substrates to interconnect with great connection versatility, and with the opportunity for convenient removal and with great resistance to failure related to repeated temperature cycling. The interposer provides space for an array of connectors which permits the right angle connections to be closely spaced, at litho- graphic tolerances. Connections between circuits on the vertical sub- strate and circuits on the horizontal substrate are made by connecting first to a circuit on the inter- poser and then to the circuit on the other substrate. The equivalent circuit model is transmission line, small inductance at the first controlled collapse connection, transmission line on the interposer, small inductance at the second controlled collapse connection, transmission line.

433746

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