Low temperature, fast curing silicone compositions

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 83/04 (2006.01) C08K 3/00 (2006.01) C08K 5/00 (2006.01) C08K 5/05 (2006.01) C08K 5/14 (2006.01) C08K 5/5419 (2006.01) C08K 5/56 (2006.01) C08L 83/05 (2006.01) C08L 83/06 (2006.01) C08L 83/07 (2006.01)

Patent

CA 2402124

Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.

Compositions à base de silicone durcissant sous l'effet de la chaleur qui utilisent la silicone réactive, un agent réticulateur à base d'hydrure de silicone et un système catalyseur qui comprend un catalyseur à base de rhodium et un système stabilisateur. On utilise également une combinaison de catalyseurs à base de rhodium et de platine. Ces compositions durcissent à basses températures et permettent d'obtenir des compositions à faible coefficient de dilatation thermique. Un système stabilisateur comprend une combinaison d'un peroxyde et d'un composé à base d'acétylène.

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