Low temperature impact and puncture resistant termoplastic...

B - Operations – Transporting – 32 – B

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B32B 27/08 (2006.01) B32B 27/32 (2006.01) B65D 30/08 (2006.01) C08L 23/14 (2006.01)

Patent

CA 1336158

Thermoplastic films and bag structures having improved low temperature impact and puncture resistance properties and high resistance to heat comprise a film layer comprising a blend of polypropylene copolymer and a material selected from polyisobutylene, very low density polyethylene, polybutylene, and ethylene-methyl acrylate copolymer, and mixtures thereof. The films and bag structures preferably have an outer film layer of a resin material having a melt temperature which is higher than that of the other film layer. The outer film layer material is preferably a polyester or a polyamide. The films and bag structures are particularly suitable for use as frozen food storage containers and for subsequent heating and/or cooking of food therein.

517629

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