Low-temperature impact resistant thermosetting epoxide resin...

Details Low-temperature impact resistant thermosetting epoxide resin... Low-temperature impact resistant thermosetting epoxide resin...

C - Chemistry, Metallurgy

08

G

C08G 18/12 (2006.01) C08G 18/28 (2006.01) C08G 18/80 (2006.01) C08G 59/40 (2006.01) C09J 175/00 (2006.01)

Patent

CA 2635031

The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (I), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.

L'invention concerne des compositions contenant au moins une résine solide époxy A, au moins un polymère B de formule (I), au moins un agent thixotrope C à base d'un dérivé d'urée, et au moins un durcisseur D pour résines époxy, lequel est activé par des températures élevées. Ces compositions sont particulièrement adaptées comme adhésifs. Il est possible de produire notamment des adhésifs résiliants à basse température qui peuvent servir en particulier d'adhésifs pour le gros oeuvre.

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