Low temperature joining of materials

H - Electricity – 01 – S

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H01S 3/17 (2006.01) B23B 17/00 (2006.01) B32B 15/00 (2006.01) B32B 18/00 (2006.01) C03C 3/06 (2006.01) C03C 3/076 (2006.01) C03C 3/089 (2006.01) C03C 3/097 (2006.01) C03C 3/12 (2006.01) C03C 3/14 (2006.01) C03C 3/247 (2006.01) C03C 3/32 (2006.01) C03C 10/00 (2006.01) C03C 27/06 (2006.01) C03C 27/10 (2006.01) C09J 1/00 (2006.01) G02B 6/12 (2006.01) G02B 6/13 (2006.01) G02B 6/30 (2006.01) G02B 6/34 (2006.01)

Patent

CA 2389464

A method for the low temperature joining of similar and/or dissimilar materials (crystals, glasses and metallic coatings) by mating at low temperature with an inorganic, aqueous solution containing phosphorus. In preferred embodiments, the materials intended for joining are polished, cleaned, and brought together with the phosphate-containing solution between the polished surfaces. Vacuum may be applied to assist in making the joint. the composite is optionally heat treated to increase strength, chemical durability, and optical performance. The bond thereby formed has low birefringence, is strong, and is virtually photonically invisible. The joints allow for the fabrication of hybrid photonic devices by a low temperature, inorganic joining process.

L'invention concerne un procédé d'assemblage de matériaux similaires et/ou non à basse température (cristaux, verres et revêtements métalliques) par appariement à basse température avec une solution aqueuse inorganique contenant du phosphore. Dans un mode de réalisation préféré, les matériaux à assembler sont polis, nettoyés et assemblés à la solution contenant du phosphate entre les surfaces polies. Une mise sous vide peut être exécutée afin d'assister la fabrication du joint. Le composite est éventuellement traité thermiquement aux fins d'accroissement de la résistance, de la durabilité chimique et des performances optiques. La liaison ainsi formée présente une faible biréfringence. Elle est forte et pour ainsi dire invisible sur le plan photonique. Les joints permettent de fabriquer des dispositifs photoniques hybrides au moyen d'un procédé d'assemblage inorganique à basse température.

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