C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 10/00 (2006.01) B29C 41/00 (2006.01) B29C 41/18 (2006.01) C08L 23/00 (2006.01) C08L 23/10 (2006.01) C08L 23/16 (2006.01)
Patent
CA 2087661
LOW TEMPERATURE MOLDABLE POWDER FOR POWDER MOLDING. POWDER MOLDING METHOD USING THE SAME AND MOLDED ARTICLE THEREOF ABSTRACT OF THE DISCLOSURE A low temperature moldable powder for powder molding comprising a thermoplastic resin or thermoplastic elastomer composition, said resin or composition having a complex dynamic viscosity ?* (170°C) of 1.5 x 105 poise or less, as measured at an atmospheric temperature of 170°C and a complex dynamic viscosity ?* (250°C) of 5.0 x 104 poise or less, as measured at an atmospheric temperature of 250°C, in dynamic viscoelasticity measurements at a frequency of 1 radian/sec and a temperature average viscosity index k, calculated from the following formula, of 10 or less: k = ?* (170°C)/?* (250°C)
Hamanaka Tatsuo
Hikasa Tadashi
Igarashi Toshio
Mendori Hiroaki
Tatsumi Masayuki
Bull Housser & Tupper Llp
Sumitomo Chemical Co. Ltd.
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