Low temperature process for depositing oxide layers by...

C - Chemistry – Metallurgy – 23 – C

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C23C 16/40 (2006.01) C01B 13/20 (2006.01) C23C 16/48 (2006.01) H01L 21/225 (2006.01) H01L 21/316 (2006.01) H01L 21/473 (2006.01)

Patent

CA 1183102

ABSTRACT OF THE DISCLOSURE The specification discloses a low temperature pro- cess for depositing oxide layers on a substrate by photo- chemical vapor deposition, by exposing the substrate to a selected vapor phase reactant in the presence of photo- chemically generated neutral (unionized) oxygen atoms. The oxygen atoms react with the vapor phase reactant to form the desired oxide, which deposits as a layer on the substrate. The use of photochemically generated neutral oxygen atoms avoids damage to the substrate due to charge bombardment or radiation bombardment of the sub- strate. The deposited oxide layer may optionally incorporate a selected dopant material in order to modify the physical, electrical, or optical character- istics of the oxide layer.

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