Low temperature solventless blend of vinyl methylsiloxane...

Details Low temperature solventless blend of vinyl methylsiloxane... Low temperature solventless blend of vinyl methylsiloxane...

C - Chemistry, Metallurgy

08

L

400/5328

C08L 83/04 (2006.01) C08K 3/36 (2006.01) C08K 7/14 (2006.01)

Patent

CA 1042129

ABSTRACT OF THE DISCLOSURE Organosilicon resins having excellent thermal shock resistance in either the filled or unfilled state are obtained by curing mixtures of (A) a copolymer of (in mole percent) 35 to 42 monophenylsiloxane units, 0 to 12 diphenylsiloxane units, 35 to 50 dimethylsiloxane units and 8 to 15 vinylmethylsiloxane units with (B) a copolymer of (in mole percent) 8 to 15 diphenylsiloxane units, 30 to 55 methylhydrogensiloxane units, 28 to 45 dimethylsiloxane units and 5 to 12 trimethylsiloxane units in amount such that there is a stoichiometric amount of SiH and Si vinyl ? 10 percent of either ingredient. The preferred fillers are mixtures of 0.08 to 0.32 cm. glass fibers and 2 to 8 micron crystalline silica.

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