Low viscosity precursor compositions and methods for the...

C - Chemistry – Metallurgy – 09 – D

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C09D 5/24 (2006.01) B05D 5/06 (2006.01) B22F 9/30 (2006.01) C09D 1/00 (2006.01) C09D 11/00 (2006.01) C23C 18/06 (2006.01) C23C 18/08 (2006.01) H01B 1/02 (2006.01) H01L 21/316 (2006.01) H05K 1/09 (2006.01) H05K 1/16 (2006.01) H05K 3/10 (2006.01) H01L 21/288 (2006.01) H01L 21/314 (2006.01) H05K 1/03 (2006.01) H05K 3/12 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2461338

Abstract A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features. Another particularly preferred precursor composition includes copper metal for the formation of highly conductive copper features.

Cette invention concerne une composition de pr~curseur servant au d~pÙt et ~ la formation d'un ~l~ment ~lectrique tel qu'un ~l~ment conducteur. Cette composition de pr~curseur a l'avantage de pr~senter une faible viscosit~, ce qui permet d'effectuer un d~pÙt ~ l'aide d'outils de gravure directe. Cette composition de pr~curseur pr~sente ~galement une temp~rature de conversion basse, ce qui permet le d~pÙt et la conversion en un ~l~ment ~lectrique sur des substrats ~ basse temp~rature. Une forme particuli­rement pr~f~r~e de cette composition de pr~curseur renferme un m~tal d'argent servant ~ la formation d'~l~ments en argent hautement conducteurs. Une autre forme particuli­rement pr~f~r~e de cette composition de pr~curseur renferme un m~tal de cuivre servant ~ la formation d'~l~ments en cuivre hautement conducteurs.

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