C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 18/67 (2006.01) C08G 18/78 (2006.01) C08J 3/02 (2006.01) C08J 3/28 (2006.01) C08L 75/04 (2006.01) C09D 175/04 (2006.01) C09J 175/04 (2006.01)
Patent
CA 2526058
The present invention relates to water-free and cosolvent-free binder compositions A) containing of a mixture of A1) at least one emulsifier-free, hydrophobic binder containing groups which can be polymerized by high-energy radiation and A2) at least one hydrophilic unsaturated polyester resin containing the reaction product of a) at least one unsaturated dicarboxylic acid and/or an anhydride thereof, b) at least one polyalkylene oxide compound having a number average molecular weight of 106 to 2000, at least 2 hydroxyl end groups and at least 2 oxyalkylene units, wherein at least 50% of the oxyalkylene units are oxyethylene units, and c) at least one hydroxy-functional compound containing at least one polymerizable unsaturated group per molecule selected from vinyl, allyl, methacrylic and acrylic groups. The present invention also relates to aqueous dispersions containing the binder compositions A), to a process for preparing an aqueous dispersion containing the binder dispersion, to a process for diluting the binder composition with tap water, to producing coatings from the aqueous dispersions and to the use of the binder compositions for preparing coating, adhesive or sealant compositions.
Fischer Wolfgang
Kopp Richard
Mueller Manfred
Weikard Jan
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