Low volatile organic solvent based adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

400/7024

C09J 11/06 (2006.01) C09J 127/06 (2006.01) C09J 127/24 (2006.01) C09J 201/00 (2006.01)

Patent

CA 2291167

The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. Desirably the adhesive has a flash point of at least 100 ~F when measured in accordance with ASTM D3828-87. The solvent blend of the low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent blends in solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, and cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices. In addition, the novel low VOC solvent based adhesive has good storage stability in metal or non-metal containers.

Cette invention concerne un adhésif à base d'un solvant organique faiblement volatile, lequel adhésif comprend un mélange d'au moins deux solvants organiques et d'une résine thermoplastique. L'adhésif possède de préférence un point éclair d'au moins 100· F tel que mesuré selon la norme ASTM D3828-87. Le mélange de solvants contenu dans cet adhésif se volatilise à des vitesses sensiblement réduites par rapport aux mélanges de solvants traditionnels utilisés dans des adhésifs à base de solvants. Ce nouvel adhésif à base de solvant organique faiblement volatile est en outre facile à appliquer, économique, et se durcit au bout d'une durée acceptable sans qu'il soit nécessaire d'utiliser de la chaleur, une lumière ultraviolette ou d'autres dispositifs mécaniques. Ce nouvel adhésif possède en outre une bonne stabilité lors de son stockage dans des conteneurs métalliques ou non métalliques.

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